Etcher
Inductively coupled plasma reactive ion etching (ICP-RIE)
Overview:
Many models are available for the etching of silicon, oxides, nitrides, metals, germanium, glass and III-V materials. Some equipements offer ICP-DRIE etching by Bosch or cryogenic process.
Models available:
ICP RIE
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SPTS AOE: instrument for glass, SiO2 and nitride etching
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| SPTS ASE-SR: instrument for Si and Ge etching: vapor-phase XeF2 etching is being developped |
STPS III-V: instrument for etching Si, Ge, metals (Cr, Ti, Al) and a wide array of III-V materials
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ICP DRIE
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| Oxford ICP380 : instrument dedicated to etching Si by cryogenic process |
| SPTS ASE SR : non-dedicated instrument, Si etching by Bosch process |
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Reactive ion etching (RIE)
available models:
Routine processes
RIE etching
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Silicon, oxide, nitride
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Wet etching
Overview:
Many wet benches are offred for liquid-phase etching and sample cleaning.
Routine processes
Etched materials
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Si <111>, Oxide, Nitride, GaAs
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HNA mon and poly Si etch
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| Metals (Cr, Au, Ni, Cu...) |
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XeF2 dry etching
Overview:
The Xactix e2 is dedicated to the iostropic etching if silicon. The etch is in gas phase, avoiding the problems typically associated with wet processes.
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Focus ion beam etching (FIB)
Available models:
Overview:
The mdel from Zeiss is multifonctional that, apart from silicon etching, permits: the deposition of metals or insulating materials, scanning electron microscopy (SEM), high resolution ebeam lithography and transmission electron microscopy (STEM).
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